PCB Integration of a Vivaldi Antenna on IPD Technology for 60-GHz Communications

The integration of a Vivaldi antenna on a printed circuit board (PCB) targeting 60-GHz WiGig applications is presented in this letter. The integrated passive device (IPD)technology from STMicroelectronics based on a glass substrate is used for the antenna manufacturing. In free space, the radiation...

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Bibliographic Details
Published in:IEEE antennas and wireless propagation letters 2014-01, Vol.13, p.678-681
Main Authors: Bisognin, Aimeric, Titz, Diane, Ferrero, Fabien, Jacquemod, Gilles, Pilard, Romain, Gianesello, Frederic, Gloria, Daniel, Brachat, Patrice, Laporte, Claire, Ezzeddine, Hilal, Luxey, Cyril
Format: Article
Language:English
Subjects:
Antenna measurements
Antenna radiation patterns
Antennas
Beams (radiation)
Boards
Circuit boards
Electromagnetism
Endfire antennas
Engineering Sciences
Gain
Glass substrates
IPD technology
millimeter-wave antennas
printed circuit board (PCB) integration
Printed circuit boards
Printed circuits
Realized gains & losses
Reflection coefficient
Substrates
Surface waves
Vivaldi antennas
Wave propagation
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Summary:The integration of a Vivaldi antenna on a printed circuit board (PCB) targeting 60-GHz WiGig applications is presented in this letter. The integrated passive device (IPD)technology from STMicroelectronics based on a glass substrate is used for the antenna manufacturing. In free space, the radiation pattern measurements show a realized gain higher than 4 dBi in the endfire direction from 56 to 65 GHz. The impact of the integration of the antenna on the PCB is investigated in details showing reasonable disturbance of the reflection coefficient, but strong modifications of the radiation pattern, especially the pointing direction of the main beam. From the analysis of the surface waves propagating along the PCB when the Vivaldi is integrated, a novel topology is proposed to preserve the main radiation in the endfire direction with enhanced realized gain.
ISSN:1536-1225
1548-5757
DOI:10.1109/LAWP.2014.2314444