Packaging and Interconnect Considerations in Neuromorphic Photonic Accelerators

Developing compute platforms capable of performing computations at high speed is essential for data processing in the next generation of data centers and edge devices. A neuromorphic photonic accelerator on a silicon photonic platform is a promising solution. Compared to silicon photonic data commun...

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Bibliographic Details
Published in:IEEE journal of selected topics in quantum electronics 2023-03, Vol.29 (2: Optical Computing), p.1-11
Main Authors: Nezami, Mohammadreza Sanadgol, de Lima, Thomas Ferreira, Mitchell, Matthew, Yu, Shangxuan, Wang, Jing, Bilodeau, Simon, Zhang, Weipeng, Al-Qadasi, Mohammed, Taghavi, Iman, Tofini, Alexander, Lin, Stephen, Shastri, Bhavin J., Prucnal, Paul R., Chrostowski, Lukas, Shekhar, Sudip
Format: Article
Language:English
Subjects:
Accelerators
co-packaging
Crosstalk
Data centers
Data communication
Data processing
Electronic devices
Heterogeneous integration
Integrated optics
Microprocessors
Modules
Neuromorphics
optical computing
Optical coupling
Optical data processing
Optical fiber sensors
Optical fibers
Optical interconnections
Optoelectronic devices
Packaging
Parallel processing
Passive components
Performance degradation
Photonics
Processors
Silicon
silicon photonics
Wires
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Summary:Developing compute platforms capable of performing computations at high speed is essential for data processing in the next generation of data centers and edge devices. A neuromorphic photonic accelerator on a silicon photonic platform is a promising solution. Compared to silicon photonic data communication transceiver modules, neuromorphic photonic accelerators constitute a large number of active and passive components and optoelectronic devices to handle the parallel processing. Thus, an increased number of optical and electrical interconnects are required, making the packaging of such processors challenging. Moreover, thermal and electrical crosstalk can dramatically degrade the performance of such processors. Thus, packaging a neuromorphic photonic accelerator for efficient processing and data movement requires careful considerations at the chip, module, and board levels. This work investigates the challenges and potential solutions for optical coupling, optical and electrical interconnections, processor-memory communication, and thermal and electrical cross-talk to develop neuromorphic photonic accelerators.
ISSN:1077-260X
1558-4542
DOI:10.1109/JSTQE.2022.3200604