The interfacial thermal conductance between a vertical single-wall carbon nanotube and a silicon substrate

Molecular dynamics simulations were conducted to investigate the interfacial thermal conductance between a functionalized single-wall carbon nanotube and a silicon substrate. Based on Fourier's law, interfacial thermal conductance of the system with different numbers of chemical bonds was calcu...

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Bibliographic Details
Published in:Journal of applied physics 2009-08, Vol.106 (3), p.034307-034307-6
Main Authors: Fan, Hai-Bo, Zhang, Kai, Yuen, Matthew M. F.
Format: Article
Language:English
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Summary:Molecular dynamics simulations were conducted to investigate the interfacial thermal conductance between a functionalized single-wall carbon nanotube and a silicon substrate. Based on Fourier's law, interfacial thermal conductance of the system with different numbers of chemical bonds was calculated. The results showed that the interfacial thermal conductance increased with the increase in the number of chemical bonds formed between the carbon nanotube and the substrate, indicating that carbon nanotube patterned on the silicon substrate by chemical functionalization can improve not only interfacial adhesion but also interfacial thermal conductance. The results also showed that a shorter chain length of the functional groups between the carbon nanotube and the substrate gave a higher interfacial thermal conductance.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.3191673