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GeSi films with reduced dislocation density grown by molecular-beam epitaxy on compliant substrates based on porous silicon
To grow high-quality heteroepitaxial layers, we propose a compliant silicon substrate consisting of a thin epitaxial silicon film on a high-density porous layer as a membrane and an expansive low-density porous layer as a mechanical damper which shields the overlying layers from the massive wafer. G...
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Published in: | Applied physics letters 1999-12, Vol.75 (26), p.4118-4120 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | To grow high-quality heteroepitaxial layers, we propose a compliant silicon substrate consisting of a thin epitaxial silicon film on a high-density porous layer as a membrane and an expansive low-density porous layer as a mechanical damper which shields the overlying layers from the massive wafer. GeSi films over the critical thickness have been grown by molecular-beam epitaxy on these substrates. Transmission electron microscopy analysis shows that Ge0.2Si0.8 films have no dislocations owing to just elastic strain relaxation whereas plastic flow in the pseudomorphic films that are being grown on conventional Si substrates occurs with generation of dislocations in a regular manner. The experimental data on porous silicon structure are presented in some detail and are briefly discussed in connection with substrate compliance. |
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ISSN: | 0003-6951 1077-3118 |
DOI: | 10.1063/1.125555 |