Multiscale structural engineering of dielectric ceramics for energy storage applications: from bulk to thin films

Dielectric capacitors with the prominent features of ultrafast charging-discharging rates and ultrahigh power densities are ubiquitous components in modern electronics. To meet the growing demand for electronics miniaturization, dielectric capacitors with high energy storage properties are extensive...

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Bibliographic Details
Published in:Nanoscale 2020-08, Vol.12 (33), p.17165-17184
Main Authors: Yao, Fang-Zhou, Yuan, Qibin, Wang, Qing, Wang, Hong
Format: Article
Language:English
Subjects:
Capacitors
Ceramics
Dielectric properties
Electronics
Energy storage
Miniaturization
Multilayers
R&D
Research & development
Structural engineering
Thin films
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Summary:Dielectric capacitors with the prominent features of ultrafast charging-discharging rates and ultrahigh power densities are ubiquitous components in modern electronics. To meet the growing demand for electronics miniaturization, dielectric capacitors with high energy storage properties are extensively researched. Here we present an overview of the recent progress in the engineering of multiscale structures of dielectric ceramics ranging from bulk to thin films. This article commences with a brief introduction of the fundamentals of dielectric ceramics, including primary parameters, a library of dielectric ceramics, and multiscale structures. Emphases are placed on the relationship between multiscale structures and energy storage properties and the rational structure design principles in dielectric ceramics. Also included are currently available multilayer ceramic capacitors based on multiscale engineered ceramic structures. Finally, challenges along with opportunities for further research and development of high-performance dielectric ceramics for electrostatic energy storage are highlighted. An overview of the recent progress in the engineering of multiscale structures of dielectric ceramics for electrostatic energy storage applications is presented.
ISSN:2040-3364
2040-3372
DOI:10.1039/d0nr04479b