Bulk Contact Between Silver Nanowires Top Electrode and Interface Layer Enables High Performance of Full‐Solution‐Processed Semitransparent Organic Solar Cell Module

The solution‐processed electrode is key to the full‐solution‐processed organic solar cells (OSCs). Silver nanowires (AgNWs) are considered as an attractive solution‐processed electrode due to their low sheet resistance and high transmittance. However, the traditional “line‐plane” contact between AgN...

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Bibliographic Details
Published in:Solar RRL 2023-09, Vol.7 (18)
Main Authors: Zha, Wusong, Chen, Li-Min, Sun, Shaoming, Gao, Xiaomei, Han, Yunfei, Liu, Tong, Luo, Qun, Chao, Yu-Chiang, Zan, Hsiao-Wen, Meng, Hsin-Fei, Zhu, Xiaozhang, Ma, Chang-Qi
Format: Article
Language:English
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Summary:The solution‐processed electrode is key to the full‐solution‐processed organic solar cells (OSCs). Silver nanowires (AgNWs) are considered as an attractive solution‐processed electrode due to their low sheet resistance and high transmittance. However, the traditional “line‐plane” contact between AgNWs and the interface buffer layer is insufficient, resulting in the low performance of full‐solution‐processed OSCs. Herein, a bulk contact structure is reported between AgNWs and interface, formed by inserting the interface layer material, such as HMoO x (hydrogen molybdenum bronze) into the AgNWs networks. The extra HMoO x can be connected with the bottom interface buffer layer, forming a longitudinal network, and wrapping the AgNWs in the longitudinal interfacial layer. This bulk contact electrode‐interface structure increases the area of AgNWs/interface layers, promoting charge transfer and collection. Besides, the top‐injected method can enable the formation of a water‐based ink film on the top of the organic layer, as well as avoid solvent erosion between AgNWs and the interface layer. Based on the bulk contact electrode‐interface structure, this work realized high performance of 12.27% and 9.54% for 0.09 cm 2 small‐area device and 10.8 cm 2 full‐solution‐processed semitransparent mini‐module. These results provide a new idea for full‐solution‐processed OSCs preparation.
ISSN:2367-198X
2367-198X
DOI:10.1002/solr.202300322