Influence of preparation parameters on the CHT curing diagrams of MUF polycondensation resins

Lignocellulosic substrates such as wood have been found to have a marked modifying influence on both lower‐temperature and higher‐temperature zones of TTT and CHT diagrams during hardening of formaldehyde‐based polycondensates. While the modifying influence of the substrate has been described, the m...

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Bibliographic Details
Published in:Journal of applied polymer science 2001-09, Vol.81 (11), p.2821-2825
Main Authors: Properzi, M., Pizzi, A., Uzielli, L.
Format: Article
Language:English
Subjects:
Application fields
Applied sciences
CHT diagram
curing diagram
Exact sciences and technology
melamine-urea-formaldehyde resins
polycondensation
Polymer industry, paints, wood
quantitative influences
resin parameters' influence
Technology of polymers
TTT diagram
wood adhesives
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Summary:Lignocellulosic substrates such as wood have been found to have a marked modifying influence on both lower‐temperature and higher‐temperature zones of TTT and CHT diagrams during hardening of formaldehyde‐based polycondensates. While the modifying influence of the substrate has been described, the modifying influence of some of the most important manufacturing parameters of the resins on the CHT diagram, not having been previously investigated, are explored here and clear trends are shown. In the case of melamine–urea–formaldehyde (MUF) resins for wood adhesives, the molar ratio (M+U):F appear to be the dominant parameter influencing the relative position of gel and vitrification curves in relation to each other. The ratio of melamine to urea does not appear to have any effect on the relative position of the curve, lacking any clear trend, at least at the higher (M+U) molar ratio of 1:1.9 used for this series of resins. In the case presented for the first time, the influence of resin manufacturing parameters on CHT curing diagrams was studied in combination with the modifications introduced by the substrate. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2821–2825, 2001
ISSN:0021-8995
1097-4628
DOI:10.1002/app.1730