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  1. 1
    Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harman.
    by Harman, George G.
    Published 1997
    Edition: 2nd ed..
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  2. 2
    Integrated circuit failure analysis : a guide to preparation techniques / Friedrich Beck ; translated by Stephen S. Wilson.
    by Beck, F. (Friedrich)
    Published 1998
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  3. 3
    Semiconductor device and failue analysis : using photon emission microscopy / Wai Kin Chim.
    by Chim, Wai Kin
    Published 2000
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  4. 4
    Failure mechanisms in semiconductor devices / E. Ajith Amerasekera, Farid N. Najm.
    by Amerasekera, E. A. (E. Ajith)
    Published 1997
    Edition: 2nd ed.
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  5. 5
    Reliability of electronic packages and semiconductor devices.
    by Di Giacomo, Giulio
    Published 1997
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