A method for quantification of the effects of size and geometry on the microstructure of miniature interconnects
Because the heterogeneity of microstructure has significant effects on the material properties of ultrafine interconnects, it should be quantified, to facilitate high-fidelity prediction of reliability. To address this challenge, a method based on autocorrelation and singular value decomposition is...
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| Main Authors: | , , |
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| Format: | Default Article |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/26831 |
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