Low frequency induction heating for the sealing of plastic microfluidic systems

Microfluidic systems are being used in many applications and the demand for such systems has been phenomenal in past decades. To meet such high volume market needs, a cheap and rapid method for sealing these microfluidic platforms which is viable for mass manufacture is highly desirable. Low frequen...

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Main Authors:	Benedikt J. Knauf, Patrick Webb, Changqing Liu, Paul Conway
Format:	Default Article
Published:	2010
Subjects:	Mechanical engineering not elsewhere classified Microfluidic systems Induction heating Plastic bonding Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/7705
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id	rr-article-9568610
record_format	Figshare
spelling	rr-article-95686102010-01-01T00:00:00Z Low frequency induction heating for the sealing of plastic microfluidic systems Benedikt J. Knauf (7201553) Patrick Webb (1258326) Changqing Liu (1249713) Paul Conway (1249635) Mechanical engineering not elsewhere classified Microfluidic systems Induction heating Plastic bonding Mechanical Engineering not elsewhere classified Microfluidic systems are being used in many applications and the demand for such systems has been phenomenal in past decades. To meet such high volume market needs, a cheap and rapid method for sealing these microfluidic platforms which is viable for mass manufacture is highly desirable. Low frequency induction heating has been introduced as potential basis of a cost-effective, rapid production method for polymer microfluidic device sealing in preceding publications. Through this technique excellent bond strength was achieved, withstanding an air-pressure of up to 590 kPa. However, it has been found that during the bonding process it is important to effectively manage the heat dissipation to prevent distortion of the microfluidic platform. The heat affected zone, and the localised melted area, must be controlled to avoid blockage of the microfluidic channels or altering the channels’ wall characteristics. This work presents an analytical approach to address the issues and provide a basis for process optimisation and design rules. 2010-01-01T00:00:00Z Text Journal contribution 2134/7705 https://figshare.com/articles/journal_contribution/Low_frequency_induction_heating_for_the_sealing_of_plastic_microfluidic_systems/9568610 CC BY-NC-ND 4.0
institution	Loughborough University
collection	Figshare
topic	Mechanical engineering not elsewhere classified Microfluidic systems Induction heating Plastic bonding Mechanical Engineering not elsewhere classified
spellingShingle	Mechanical engineering not elsewhere classified Microfluidic systems Induction heating Plastic bonding Mechanical Engineering not elsewhere classified Benedikt J. Knauf Patrick Webb Changqing Liu Paul Conway Low frequency induction heating for the sealing of plastic microfluidic systems
description	Microfluidic systems are being used in many applications and the demand for such systems has been phenomenal in past decades. To meet such high volume market needs, a cheap and rapid method for sealing these microfluidic platforms which is viable for mass manufacture is highly desirable. Low frequency induction heating has been introduced as potential basis of a cost-effective, rapid production method for polymer microfluidic device sealing in preceding publications. Through this technique excellent bond strength was achieved, withstanding an air-pressure of up to 590 kPa. However, it has been found that during the bonding process it is important to effectively manage the heat dissipation to prevent distortion of the microfluidic platform. The heat affected zone, and the localised melted area, must be controlled to avoid blockage of the microfluidic channels or altering the channels’ wall characteristics. This work presents an analytical approach to address the issues and provide a basis for process optimisation and design rules.
format	Default Article
author	Benedikt J. Knauf Patrick Webb Changqing Liu Paul Conway
author_facet	Benedikt J. Knauf Patrick Webb Changqing Liu Paul Conway
author_sort	Benedikt J. Knauf (7201553)
title	Low frequency induction heating for the sealing of plastic microfluidic systems
title_short	Low frequency induction heating for the sealing of plastic microfluidic systems
title_full	Low frequency induction heating for the sealing of plastic microfluidic systems
title_fullStr	Low frequency induction heating for the sealing of plastic microfluidic systems
title_full_unstemmed	Low frequency induction heating for the sealing of plastic microfluidic systems
title_sort	low frequency induction heating for the sealing of plastic microfluidic systems
publishDate	2010
url	https://hdl.handle.net/2134/7705
_version_	1797378581158952960

Low frequency induction heating for the sealing of plastic microfluidic systems

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