Degradation of interfacial adhesion strength within photovoltaic mini-modules during damp-heat exposure
The degradation of adhesion strength between the back sheet and encapsulant due to moisture penetration has been investigated for commercial crystalline silicon photovoltaic mini-modules. The damp-heat tests originating from the International Electrotechnical Commission qualification test were carri...
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| Main Authors: | , , , |
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| Format: | Default Article |
| Published: |
2014
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/14188 |
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