Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb system
Liquid solder joints have previously been proposed in order to improve the reliability of solder joints in general, and especially for those that are operated at elevated temperatures. The solder is designed to melt during high temperature operation, releasing the stresses on the joint. The componen...
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| Main Authors: | , , , , , |
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| Format: | Default Conference proceeding |
| Published: |
2007
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/4213 |
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