The role of EVA encapsulation in the degradation of wafer based PV modules
This paper investigates the effects of ethylene vinyl acetate (EVA) encapsulation on PV module ageing and how crosslinking degree of encapsulation influences module durability under damp-heat (DH) and thermal cycle (TC) stresses. Results show that the high crosslinking samples favoured TC stresses,...
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rr-article-95573302016-01-01T00:00:00Z The role of EVA encapsulation in the degradation of wafer based PV modules Jiang Zhu (1253214) Daniel Montiel-Chicharro (7208729) Michael Owen-Bellini (7203038) Tom Betts (1258395) Ralph Gottschalg (1247661) Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified This paper investigates the effects of ethylene vinyl acetate (EVA) encapsulation on PV module ageing and how crosslinking degree of encapsulation influences module durability under damp-heat (DH) and thermal cycle (TC) stresses. Results show that the high crosslinking samples favoured TC stresses, while the low crosslinking samples performed better under DH stresses. The primary mechanism of DH-induced degradation is series resistance (RS) increase and parallel resistance (RP) decrease due to moisture ingress and grid/contact corrosion. Comparison analysis of the result indicates that the lower cross-linked EVA appeared to be able to accommodate a smaller amount of the generated acetic acid and thus resulted in a lower corrosion rate. The primary effect of TC is to impose thermal expansion/compression on device. The EVA with lower crosslinking degree is less compact and the freedom of motion of EVA macromolecules is higher, which appeared to be less resistant to the effect of expansion/compression 2016-01-01T00:00:00Z Text Conference contribution 2134/32502 https://figshare.com/articles/conference_contribution/The_role_of_EVA_encapsulation_in_the_degradation_of_wafer_based_PV_modules/9557330 CC BY-NC-ND 4.0 |
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Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified |
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Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified Jiang Zhu Daniel Montiel-Chicharro Michael Owen-Bellini Tom Betts Ralph Gottschalg The role of EVA encapsulation in the degradation of wafer based PV modules |
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This paper investigates the effects of ethylene vinyl acetate (EVA) encapsulation on PV module ageing and how crosslinking degree of encapsulation influences module durability under damp-heat (DH) and thermal cycle (TC) stresses. Results show that the high crosslinking samples favoured TC stresses, while the low crosslinking samples performed better under DH stresses. The primary mechanism of DH-induced degradation is series resistance (RS) increase and parallel resistance (RP) decrease due to moisture ingress and grid/contact corrosion. Comparison analysis of the result indicates that the lower cross-linked EVA appeared to be able to accommodate a smaller amount of the generated acetic acid and thus resulted in a lower corrosion rate. The primary effect of TC is to impose thermal expansion/compression on device. The EVA with lower crosslinking degree is less compact and the freedom of motion of EVA macromolecules is higher, which appeared to be less resistant to the effect of expansion/compression |
format |
Default Conference proceeding |
author |
Jiang Zhu Daniel Montiel-Chicharro Michael Owen-Bellini Tom Betts Ralph Gottschalg |
author_facet |
Jiang Zhu Daniel Montiel-Chicharro Michael Owen-Bellini Tom Betts Ralph Gottschalg |
author_sort |
Jiang Zhu (1253214) |
title |
The role of EVA encapsulation in the degradation of wafer based PV modules |
title_short |
The role of EVA encapsulation in the degradation of wafer based PV modules |
title_full |
The role of EVA encapsulation in the degradation of wafer based PV modules |
title_fullStr |
The role of EVA encapsulation in the degradation of wafer based PV modules |
title_full_unstemmed |
The role of EVA encapsulation in the degradation of wafer based PV modules |
title_sort |
role of eva encapsulation in the degradation of wafer based pv modules |
publishDate |
2016 |
url |
https://hdl.handle.net/2134/32502 |
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1794747800334893056 |