Crystallographic structure and mechanical behaviour of SnAgCu solder interconnects under a constant loading rate
With the continuing increase of the integration density in electronics, dimensions of interconnections for electronic components have been miniaturized to a scale that is comparable to those of their crystallographic structure. For instance, a SnAgCu solder joint in the flip chip package can contain...
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| Main Authors: | , , , |
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| Format: | Default Conference proceeding |
| Published: |
2007
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/5339 |
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