Mechanical response of indium micro-joints to low temperature cycling
In this study, mechanical properties of indium micro-joints exposed to low temperature cycling were investigated. The metallization structure of Ni/Cu was specially used as a substrate to form indium joints for mechanical tests. This paper focuses mainly on the tensile test of indium joints at therm...
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Main Authors: | X. Cheng, Changqing Liu, Vadim Silberschmidt |
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Format: | Default Conference proceeding |
Published: |
2009
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Subjects: | |
Online Access: | https://hdl.handle.net/2134/5332 |
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