Mechanical response of indium micro-joints to low temperature cycling

In this study, mechanical properties of indium micro-joints exposed to low temperature cycling were investigated. The metallization structure of Ni/Cu was specially used as a substrate to form indium joints for mechanical tests. This paper focuses mainly on the tensile test of indium joints at therm...

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Bibliographic Details
Main Authors: X. Cheng, Changqing Liu, Vadim Silberschmidt
Format: Default Conference proceeding
Published: 2009
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