Reflow soldering process simulation: a simplified model
Established models of temperature development during reflow soldering have used general purpose, finite difference (FD) or computational fluid dynamics modelling tools to create detailed representations of both the product and the reflow furnace. Such models have been shown to achieve a high degree...
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| Format: | Default Text |
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2002
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| Online Access: | https://hdl.handle.net/2134/3979 |
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