Microstructure-based multiphysics modeling for semiconductor integration and packaging
Semiconductor technology and packaging is advancing rapidly toward system integration where the packaging is co-designed and co-manufactured along with the wafer fabrication. However, materials issues, in particular the mesoscale microstructure, have to date been excluded from the integrated product...
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| Main Authors: | , , , , , , , |
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| Format: | Default Article |
| Published: |
2014
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/16074 |
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