APA Edition Citation

Huang, Z., Xiong, H., Wu, Z., Conway, P., Davies, H., Dinsdale, A., . . . Zeng, Q. (2014). Microstructure-based multiphysics modeling for semiconductor integration and packaging.

Chicago Edition Citation

Huang, Zhiheng, Hua Xiong, Zhiyong Wu, Paul Conway, Hugh Davies, Alan Dinsdale, Yunfei En, and Qingfeng Zeng. Microstructure-based Multiphysics Modeling for Semiconductor Integration and Packaging. 2014.

MLA Edition Citation

Huang, Zhiheng, et al. Microstructure-based Multiphysics Modeling for Semiconductor Integration and Packaging. 2014.

Warning: These citations may not always be 100% accurate.