Materials and processing of TSV
3D microelectronic packaging is the industry trend to meet the ever-increasing market demand for increased performance, lower power, smaller footprint, lower cost, and integration of heterogeneous devices. Chapters 1 and 2 have discussed ...
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| Main Authors: | , , , |
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| Format: | Default Book chapter |
| Published: |
2017
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/24161 |
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