Effects of the microstructure of copper through-silicon vias on their thermally induced linear elastic mechanical behavior
Through-silicon vias (TSVs) have been investigated extensively in recent years. However, the physical mechanisms behind some of the common problems associated with TSVs, such as the protrusion of Cu vias, are still unknown. In addition, since the dimensions of TSVs have been shrunk to microscopic le...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Default Article |
| Published: |
2014
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/26077 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|