A study on indium joints for low-temperature microelectronics interconnections
For microelectronics used in the low-temperature applications, the understanding of their reliability and performance has become an important research subject characterised as electronics to serve under the severe or extreme service conditions. Along with the impact from the increased miniaturizatio...
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| Format: | Default Thesis |
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2011
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| Online Access: | https://hdl.handle.net/2134/9093 |
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