Mechanisms of thermoplastics-to-metal adhesion for applications in electronics manufacture
The Substrateless Packaging process was developed at Loughborough University as an alternative method of manufacturing electronics with an improved end-of-life materials recovery profile. The process involves injection moulding to overmould electronic components in thermoplastic polymers. Initial pr...
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| Format: | Default Thesis |
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2011
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| Online Access: | https://hdl.handle.net/2134/8531 |
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