Novel manufacture of out-of-plane optical interconnects to enable low-cost OECB substrates
Due to their bandwidth capacity, optical interconnects are beginning to replace bandwidth limited copper as bottlenecks appear on both inter-board, VSR interconnects and also inter-board, USR interconnects. Consequently, low-cost, optically enabled circuit boards are a key milestone on electronic ro...
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| Format: | Default Thesis |
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2005
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| Online Access: | https://hdl.handle.net/2134/35326 |
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