Investigation of plastic package related failure mechanisms in plastic encapsulated integrated circuits
An experimental study has been conducted into the effects of package related failures in plastic encapsulated semiconductors. As a result of an extensive literature survey particular emphasis was placed on thermal and moisture related failure mechanisms. A number of accelerated life testing techniqu...
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Format: | Default Thesis |
Published: |
1996
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Online Access: | https://hdl.handle.net/2134/10543 |
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