Investigation of plastic package related failure mechanisms in plastic encapsulated integrated circuits

An experimental study has been conducted into the effects of package related failures in plastic encapsulated semiconductors. As a result of an extensive literature survey particular emphasis was placed on thermal and moisture related failure mechanisms. A number of accelerated life testing techniqu...

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Bibliographic Details
Main Author: Nicholas M. Troop
Format: Default Thesis
Published: 1996
Subjects:
Online Access:https://hdl.handle.net/2134/10543
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