Silicon wafer bonding technology for VLSI and MEMS applications Subramanian S. Iyer and Andre J. Auberton-Herve (ed.).

Silicon wafer bonding technology for VLSI and MEMS applications Subramanian S. Iyer and Andre J. Auberton-Herve (ed.).

Saved in:
Bibliographic Details
Corporate Author: Institution of Electrical Engineers
Other Authors: Iyer, Subramanian S., Auberton-Herve, Andre J.
Format: eBook
Language:English
Published: Stevenage : IET, 2002.
Series:EMIS processing series 1
Subjects:
Bonding.
Electric resistance.
Integrated circuits > Very large scale integration.
Micromechanics.
Semiconductor wafers.
Silicon.
Silicon-on-insulator technology.
Online Access:http://dx.doi.org/10.1049/PBEP001E
Tags: Add Tag
No Tags, Be the first to tag this record!
Login for hold information

Internet

http://dx.doi.org/10.1049/PBEP001E

Online Resource - Electronic book

Copy [B446534] Available

Similar Items