Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li. 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
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Main Author: | Li, Er-Ping |
---|---|
Corporate Author: | Wiley InterScience (Online service) |
Format: | eBook |
Language: | English |
Published: |
[United States] : Hoboken :
IEEE Press ; Wiley,
c2012.
|
Subjects: | |
Online Access: | http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551 |
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