Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li. 3D integrated circuits and packaging, signal integrity, power integrity and EMC /

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Bibliographic Details
Main Author: Li, Er-Ping
Corporate Author: Wiley InterScience (Online service)
Format: eBook
Language:English
Published: [United States] : Hoboken : IEEE Press ; Wiley, c2012.
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Online Access:http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
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