Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li. 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
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| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
[United States] : Hoboken :
IEEE Press ; Wiley,
c2012.
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| Subjects: | |
| Online Access: | http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551 |
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| 245 | 1 | 0 | |a Electrical modeling and design for 3D system integration |h [electronic resource] : |b 3D integrated circuits and packaging, signal integrity, power integrity and EMC / |c Er-Ping Li. |
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| 650 | 0 | |a Three-dimensional integrated circuits. | |
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