APA Edition Citation

Li, E. (2012). Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li: 3D integrated circuits and packaging, signal integrity, power integrity and EMC. IEEE Press ; Wiley.

Chicago Edition Citation

Li, Er-Ping. Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC / Er-Ping Li: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. [United States] : Hoboken: IEEE Press ; Wiley, 2012.

MLA Edition Citation

Li, Er-Ping. Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC / Er-Ping Li: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. IEEE Press ; Wiley, 2012.