IEEE 9th VLSI Packaging Workshop in Japan VPWJ 2008 : December 1st-2nd, 2008, the Westin Miyako Kyoto, Kyoto, Japan / sponsored by the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society and cooperatively sponsored by the National Institute of Standards and Technology (NIST).

IEEE 9th VLSI Packaging Workshop in Japan VPWJ 2008 : December 1st-2nd, 2008, the Westin Miyako Kyoto, Kyoto, Japan / sponsored by the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society and cooperatively sponsored by the National Institute of Standards and Technology (NIST). VPWJ 2008 : December 1st-2nd, 2008, the Westin Miyako Kyoto, Kyoto, Japan /

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Bibliographic Details
Corporate Authors: VLSI Packaging Workshop in Japan Kyoto, Japan, Components, Packaging & Manufacturing Technology Society, National Institute of Standards and Technology (U.S.)
Format: eBook
Language:English
Published: Piscataway, NJ : IEEE, c2008.
Subjects:
Electronic packaging > Congresses.
Integrated circuits > Very large scale integration > Congresses.
Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=4745909
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