Similar Items

• Extended abstracts of the Seventh International Workshop on Junction Technology June 8-9, 2007, Kyoto, Japan / sponsored by Japan Society of Applied Physics/Silicon Technology Division, Chinese Institute of Electronics, and SEMI Japan ; technically cosponsored by IEEE EDS, IEEE EDS Japan Chapter, and IEEE DES Kansai Chapter.
  Published: (2007)
• Extended abstracts of the FIfth International Workshop on Junction Technology June 7-8, 2005, Osaka Japan / sponsored by the Japan Society of Applied Physics, Silicon Technology Division, Chinese Institute of Electronics and SEMI Japan.
  Published: (2006)
• 2008 International Conference on Simulation of Semiconductor Processes and Devices SISPAD 2008 : September 9-11, 2008, Yumoto Fujiya Hotel, Hakone, Japan / co-sponsored by Japan Society of Applied Physics ... [et al.] in cooperation with The Institute of Electronics, Information and Communication Engineers, IEEE EDS Japan Chapter, IEEE EDS Kansai Chapter.
  Published: (2008)
• Proceedings of the IEEE 2007 International Interconnect Technology Conference [IEEE].
  Published: (2007)
• ISSM 2006 conference proceedings : the Thirteenth International Symposium on Semiconductor Manufacturing : September 25-27, 2006, Century Hyatt Tokyo, Tokyo, Japan / sponsored by the Japan Society of Applied Physics (JSAP), IEEE Electron Devices Society, Semiconductor Equipment and Materials International (SEMI).
  Published: (2006)