Microelectronics packaging handbook edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein. Pt. 2, Semiconductor packaging /
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| Other Authors: | , , |
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| Format: | Book |
| Language: | English |
| Published: |
London :
Chapman & Hall,
1997.
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| Edition: | 2nd ed. |
| Subjects: | |
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Pilkington Library - Pilkington Main Collection
| Shelfmark: |
621.381046/MIC |
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| Copy [0402528638] | Available |
| Copy [0401464318] | Available |