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Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls
Purpose - To investigate effects of the thermal history on intermetallic thickness and morphology and on the resulting shear strength of the ball attachment for a variety of BGA components.Design methodology approach - In this study, a variety of BGA components with balls made of Pb-free Sn-Ag-Cu (S...
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Published in: | Soldering & surface mount technology 2007-02, Vol.19 (1), p.4-14 |
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creator | Liang, J Dariavach, N Callahan, P Shangguan, D |
description | Purpose - To investigate effects of the thermal history on intermetallic thickness and morphology and on the resulting shear strength of the ball attachment for a variety of BGA components.Design methodology approach - In this study, a variety of BGA components with balls made of Pb-free Sn-Ag-Cu (SAC) 305, Sn-Pb eutectic and high-temperature 90Pb-10Sn alloys, were subjected to different thermal histories, including up to ten reflow cycles, and aged at 125°C from 24 to 336 h. The intermetallic thickness and morphology after these thermal events were then examined under optical and scanning electronic microscopes. Ball shearing tests were conducted to investigate effects of the thermal history and intermetallic thickness and morphology on shearing strength of these solder balls.Findings - The results show that effects directly from intermetallic layers may or may not be detectable; and the shear strength of solder balls is largely dependent on the solder alloy and its microstructure. Shear strength increases are observed after multiple reflow cycles and ageing at elevated temperature for the two Pb-bearing alloys, while the SAC305 lead-free alloy shows slight reductions in both strength and ductility after thermal exposure.Practical implications - Presented results can be used for estimation of reliability for electronic assemblies subjected to multiple rework and repair operations, which expose sensitive components, such as BGAs, to elevated temperatures.Originality value - It is believed that a sound understanding of the effects of intermetallic morphology and thickness on reliability of BGA solder balls can lead to more intelligent choice of soldering processes, as well as to rework repair process optimisation and to establishing their operational limits. |
doi_str_mv | 10.1108/09540910710748113 |
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The intermetallic thickness and morphology after these thermal events were then examined under optical and scanning electronic microscopes. Ball shearing tests were conducted to investigate effects of the thermal history and intermetallic thickness and morphology on shearing strength of these solder balls.Findings - The results show that effects directly from intermetallic layers may or may not be detectable; and the shear strength of solder balls is largely dependent on the solder alloy and its microstructure. Shear strength increases are observed after multiple reflow cycles and ageing at elevated temperature for the two Pb-bearing alloys, while the SAC305 lead-free alloy shows slight reductions in both strength and ductility after thermal exposure.Practical implications - Presented results can be used for estimation of reliability for electronic assemblies subjected to multiple rework and repair operations, which expose sensitive components, such as BGAs, to elevated temperatures.Originality value - It is believed that a sound understanding of the effects of intermetallic morphology and thickness on reliability of BGA solder balls can lead to more intelligent choice of soldering processes, as well as to rework repair process optimisation and to establishing their operational limits.</description><identifier>ISSN: 0954-0911</identifier><identifier>EISSN: 1758-6836</identifier><identifier>DOI: 10.1108/09540910710748113</identifier><identifier>CODEN: SSMOEO</identifier><language>eng</language><publisher>Bradford: Emerald Group Publishing Limited</publisher><subject>Aging ; Alloys ; Applied sciences ; Circuits ; Design. Technologies. Operation analysis. Testing ; Electronics ; Exact sciences and technology ; Impact strength ; Integrated circuits ; Intermetallic compounds ; Load ; Mechanical properties ; Metal fatigue ; Morphology ; Product reliability ; Scanning electron microscopy ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Shear strength ; Shear tests ; Soldering ; Studies ; Temperature</subject><ispartof>Soldering & surface mount technology, 2007-02, Vol.19 (1), p.4-14</ispartof><rights>Emerald Group Publishing Limited</rights><rights>2007 INIST-CNRS</rights><rights>Copyright Emerald Group Publishing Limited 2007</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c357t-37aa9c99cd4c44d7a795a7520ef31b32f20569a2e27084495d16824761a438223</citedby><cites>FETCH-LOGICAL-c357t-37aa9c99cd4c44d7a795a7520ef31b32f20569a2e27084495d16824761a438223</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>315,786,790,27957,27958</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=18742168$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Liang, J</creatorcontrib><creatorcontrib>Dariavach, N</creatorcontrib><creatorcontrib>Callahan, P</creatorcontrib><creatorcontrib>Shangguan, D</creatorcontrib><title>Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls</title><title>Soldering & surface mount technology</title><description>Purpose - To investigate effects of the thermal history on intermetallic thickness and morphology and on the resulting shear strength of the ball attachment for a variety of BGA components.Design methodology approach - In this study, a variety of BGA components with balls made of Pb-free Sn-Ag-Cu (SAC) 305, Sn-Pb eutectic and high-temperature 90Pb-10Sn alloys, were subjected to different thermal histories, including up to ten reflow cycles, and aged at 125°C from 24 to 336 h. The intermetallic thickness and morphology after these thermal events were then examined under optical and scanning electronic microscopes. Ball shearing tests were conducted to investigate effects of the thermal history and intermetallic thickness and morphology on shearing strength of these solder balls.Findings - The results show that effects directly from intermetallic layers may or may not be detectable; and the shear strength of solder balls is largely dependent on the solder alloy and its microstructure. Shear strength increases are observed after multiple reflow cycles and ageing at elevated temperature for the two Pb-bearing alloys, while the SAC305 lead-free alloy shows slight reductions in both strength and ductility after thermal exposure.Practical implications - Presented results can be used for estimation of reliability for electronic assemblies subjected to multiple rework and repair operations, which expose sensitive components, such as BGAs, to elevated temperatures.Originality value - It is believed that a sound understanding of the effects of intermetallic morphology and thickness on reliability of BGA solder balls can lead to more intelligent choice of soldering processes, as well as to rework repair process optimisation and to establishing their operational limits.</description><subject>Aging</subject><subject>Alloys</subject><subject>Applied sciences</subject><subject>Circuits</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Impact strength</subject><subject>Integrated circuits</subject><subject>Intermetallic compounds</subject><subject>Load</subject><subject>Mechanical properties</subject><subject>Metal fatigue</subject><subject>Morphology</subject><subject>Product reliability</subject><subject>Scanning electron microscopy</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Shear strength</subject><subject>Shear tests</subject><subject>Soldering</subject><subject>Studies</subject><subject>Temperature</subject><issn>0954-0911</issn><issn>1758-6836</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNqNkV9LHDEUxUNRcKt-AN9CoX3qaP5OkkcVawuCC-rzkM3cuCMzyTbJIn77ZrsLhSooXLhw8jvnknsROqHklFKiz4iRghhKVC2hKeWf0IwqqZtW83YPzTbvTQXoAfqc8xMhRLSGz1C58h5cyTh6XJaQJjvi5ZBLTC84ho2Eh1CqDsWO4-DwY4rPZYlt6PEEbmnD4KollwThseo1Zr5ofAL4i9yFZr7AF9fnOMexh4QXNSUfoX1vxwzHu36IHn5c3V_-bG5ur39dnt80jktVGq6sNc4Y1wsnRK-sMtIqyQh4TheceUZkaywDpogWwsietpoJ1VIruGaMH6Jv29xVir_XkEs3DdnBONoAcZ07zqmWXJB3QWY0rSUr-OU_8CmuU6if6BhtGVFMthWiW8ilmHMC363SMNn00lHSba7VvbpW9XzdBdtcF-qTDW7I_4xaiTpAV45sOZgg2bH_UPT3ty2v0G7Ve_4HjRWtdQ</recordid><startdate>20070213</startdate><enddate>20070213</enddate><creator>Liang, J</creator><creator>Dariavach, N</creator><creator>Callahan, P</creator><creator>Shangguan, D</creator><general>Emerald Group Publishing Limited</general><general>Emerald</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7RQ</scope><scope>7SP</scope><scope>7TB</scope><scope>7WY</scope><scope>7XB</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>FR3</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K6~</scope><scope>KB.</scope><scope>KR7</scope><scope>L.-</scope><scope>L7M</scope><scope>M0F</scope><scope>M2P</scope><scope>PDBOC</scope><scope>PQBIZ</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>Q9U</scope></search><sort><creationdate>20070213</creationdate><title>Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls</title><author>Liang, J ; Dariavach, N ; Callahan, P ; Shangguan, D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c357t-37aa9c99cd4c44d7a795a7520ef31b32f20569a2e27084495d16824761a438223</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Aging</topic><topic>Alloys</topic><topic>Applied sciences</topic><topic>Circuits</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Impact strength</topic><topic>Integrated circuits</topic><topic>Intermetallic compounds</topic><topic>Load</topic><topic>Mechanical properties</topic><topic>Metal fatigue</topic><topic>Morphology</topic><topic>Product reliability</topic><topic>Scanning electron microscopy</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Shear strength</topic><topic>Shear tests</topic><topic>Soldering</topic><topic>Studies</topic><topic>Temperature</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Liang, J</creatorcontrib><creatorcontrib>Dariavach, N</creatorcontrib><creatorcontrib>Callahan, P</creatorcontrib><creatorcontrib>Shangguan, D</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Career & Technical Education Database</collection><collection>Electronics & Communications Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>ABI/INFORM Collection</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central</collection><collection>ProQuest Central Essentials</collection><collection>AUTh Library subscriptions: ProQuest Central</collection><collection>ProQuest Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central</collection><collection>Engineering Research Database</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection (Proquest) (PQ_SDU_P3)</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection</collection><collection>ProQuest Materials Science Database</collection><collection>Civil Engineering Abstracts</collection><collection>ABI/INFORM Professional Advanced</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ABI/INFORM Trade & Industry</collection><collection>Science Database (ProQuest)</collection><collection>Materials Science Collection</collection><collection>One Business (ProQuest)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>ProQuest Central Basic</collection><jtitle>Soldering & surface mount technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Liang, J</au><au>Dariavach, N</au><au>Callahan, P</au><au>Shangguan, D</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls</atitle><jtitle>Soldering & surface mount technology</jtitle><date>2007-02-13</date><risdate>2007</risdate><volume>19</volume><issue>1</issue><spage>4</spage><epage>14</epage><pages>4-14</pages><issn>0954-0911</issn><eissn>1758-6836</eissn><coden>SSMOEO</coden><notes>ObjectType-Article-2</notes><notes>SourceType-Scholarly Journals-1</notes><notes>ObjectType-Feature-1</notes><notes>content type line 23</notes><abstract>Purpose - To investigate effects of the thermal history on intermetallic thickness and morphology and on the resulting shear strength of the ball attachment for a variety of BGA components.Design methodology approach - In this study, a variety of BGA components with balls made of Pb-free Sn-Ag-Cu (SAC) 305, Sn-Pb eutectic and high-temperature 90Pb-10Sn alloys, were subjected to different thermal histories, including up to ten reflow cycles, and aged at 125°C from 24 to 336 h. The intermetallic thickness and morphology after these thermal events were then examined under optical and scanning electronic microscopes. Ball shearing tests were conducted to investigate effects of the thermal history and intermetallic thickness and morphology on shearing strength of these solder balls.Findings - The results show that effects directly from intermetallic layers may or may not be detectable; and the shear strength of solder balls is largely dependent on the solder alloy and its microstructure. Shear strength increases are observed after multiple reflow cycles and ageing at elevated temperature for the two Pb-bearing alloys, while the SAC305 lead-free alloy shows slight reductions in both strength and ductility after thermal exposure.Practical implications - Presented results can be used for estimation of reliability for electronic assemblies subjected to multiple rework and repair operations, which expose sensitive components, such as BGAs, to elevated temperatures.Originality value - It is believed that a sound understanding of the effects of intermetallic morphology and thickness on reliability of BGA solder balls can lead to more intelligent choice of soldering processes, as well as to rework repair process optimisation and to establishing their operational limits.</abstract><cop>Bradford</cop><pub>Emerald Group Publishing Limited</pub><doi>10.1108/09540910710748113</doi><tpages>11</tpages></addata></record> |
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source | Emerald:Jisc Collections:Emerald Subject Collections HE and FE 2024-2026:Emerald Premier (reading list) |
subjects | Aging Alloys Applied sciences Circuits Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Impact strength Integrated circuits Intermetallic compounds Load Mechanical properties Metal fatigue Morphology Product reliability Scanning electron microscopy Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Shear strength Shear tests Soldering Studies Temperature |
title | Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls |
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