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Electrodeposition of FeCoNi thin films for magnetic-MEMS devices
The physical properties, including macro and microstructures, film stress, and corrosion resistances, along with the magnetic properties of electrodeposited FeCoNi thin films, which can be later integrated to magnetic-MEMS devices were systematically investigated by varying film composition. Increas...
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| Published in: | Electrochimica acta 2006-09, Vol.51 (28), p.6346-6352 |
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| Main Authors: | , , , |
| Format: | Article |
| Language: | English |
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| cited_by | cdi_FETCH-LOGICAL-c442t-242ddeb90903ab7fb4cbb5677ef098145cd4fecca63dc8ff4c3aade68a3826c83 |
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| cites | cdi_FETCH-LOGICAL-c442t-242ddeb90903ab7fb4cbb5677ef098145cd4fecca63dc8ff4c3aade68a3826c83 |
| container_end_page | 6352 |
| container_issue | 28 |
| container_start_page | 6346 |
| container_title | Electrochimica acta |
| container_volume | 51 |
| creator | Yoo, B.Y. Hernandez, S.C. Park, D.-Y. Myung, N.V. |
| description | The physical properties, including macro and microstructures, film stress, and corrosion resistances, along with the magnetic properties of electrodeposited FeCoNi thin films, which can be later integrated to magnetic-MEMS devices were systematically investigated by varying film composition. Increased Ni content affected both macro and microstructure of electrodeposits, switching from columnar structure to lamellar structure and from body centered cubic (BCC) to face centered cubic (FCC), respectively. The film stress of electrodeposits was increased with increasing deposit Ni content and it was inversely proportional to grain size. The corrosion resistance of films determined by polarization resistance and pitting potential initially improved with increasing deposit nickel content, followed by a maximum at ∼48
at.% deposit Ni content. After reaching an upper limit, the corrosion resistance slightly decreased with increasing deposit Ni content. The coercivity of FeCoNi alloy decreased when Ni content increased from 0
at.% to ∼13
at.% which might be due to decrease in grain size. However, from ∼13
at.% to ∼48
at.%, coercivity increased, which could be predominately affected by changes in film stress and microstructure. Fe-rich FeCoNi thin films (e.g. 68Fe29Co 3Ni) show good magnetic properties with minimum film stress for magnetic-MEMS actuated in the out-of-plane direction. |
| doi_str_mv | 10.1016/j.electacta.2006.04.020 |
| format | article |
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at.% deposit Ni content. After reaching an upper limit, the corrosion resistance slightly decreased with increasing deposit Ni content. The coercivity of FeCoNi alloy decreased when Ni content increased from 0
at.% to ∼13
at.% which might be due to decrease in grain size. However, from ∼13
at.% to ∼48
at.%, coercivity increased, which could be predominately affected by changes in film stress and microstructure. Fe-rich FeCoNi thin films (e.g. 68Fe29Co 3Ni) show good magnetic properties with minimum film stress for magnetic-MEMS actuated in the out-of-plane direction.</description><identifier>ISSN: 0013-4686</identifier><identifier>EISSN: 1873-3859</identifier><identifier>DOI: 10.1016/j.electacta.2006.04.020</identifier><identifier>CODEN: ELCAAV</identifier><language>eng</language><publisher>Oxford: Elsevier Ltd</publisher><subject>Chemistry ; Cross-disciplinary physics: materials science; rheology ; Electrochemistry ; Electrodeposition ; Electrodeposition, electroplating ; Exact sciences and technology ; FeCoNi ; Film stress ; General and physical chemistry ; Magnetic thin film ; Materials science ; Methods of deposition of films and coatings; film growth and epitaxy ; Microstructure ; Physics ; Study of interfaces</subject><ispartof>Electrochimica acta, 2006-09, Vol.51 (28), p.6346-6352</ispartof><rights>2006 Elsevier Ltd</rights><rights>2007 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c442t-242ddeb90903ab7fb4cbb5677ef098145cd4fecca63dc8ff4c3aade68a3826c83</citedby><cites>FETCH-LOGICAL-c442t-242ddeb90903ab7fb4cbb5677ef098145cd4fecca63dc8ff4c3aade68a3826c83</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>315,786,790,27957,27958</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=18092765$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Yoo, B.Y.</creatorcontrib><creatorcontrib>Hernandez, S.C.</creatorcontrib><creatorcontrib>Park, D.-Y.</creatorcontrib><creatorcontrib>Myung, N.V.</creatorcontrib><title>Electrodeposition of FeCoNi thin films for magnetic-MEMS devices</title><title>Electrochimica acta</title><description>The physical properties, including macro and microstructures, film stress, and corrosion resistances, along with the magnetic properties of electrodeposited FeCoNi thin films, which can be later integrated to magnetic-MEMS devices were systematically investigated by varying film composition. Increased Ni content affected both macro and microstructure of electrodeposits, switching from columnar structure to lamellar structure and from body centered cubic (BCC) to face centered cubic (FCC), respectively. The film stress of electrodeposits was increased with increasing deposit Ni content and it was inversely proportional to grain size. The corrosion resistance of films determined by polarization resistance and pitting potential initially improved with increasing deposit nickel content, followed by a maximum at ∼48
at.% deposit Ni content. After reaching an upper limit, the corrosion resistance slightly decreased with increasing deposit Ni content. The coercivity of FeCoNi alloy decreased when Ni content increased from 0
at.% to ∼13
at.% which might be due to decrease in grain size. However, from ∼13
at.% to ∼48
at.%, coercivity increased, which could be predominately affected by changes in film stress and microstructure. Fe-rich FeCoNi thin films (e.g. 68Fe29Co 3Ni) show good magnetic properties with minimum film stress for magnetic-MEMS actuated in the out-of-plane direction.</description><subject>Chemistry</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Electrochemistry</subject><subject>Electrodeposition</subject><subject>Electrodeposition, electroplating</subject><subject>Exact sciences and technology</subject><subject>FeCoNi</subject><subject>Film stress</subject><subject>General and physical chemistry</subject><subject>Magnetic thin film</subject><subject>Materials science</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Microstructure</subject><subject>Physics</subject><subject>Study of interfaces</subject><issn>0013-4686</issn><issn>1873-3859</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2006</creationdate><recordtype>article</recordtype><recordid>eNqFkMtOwzAQRS0EEqXwDWQDu4RJ4jjODlS1gMRjAawtZzwGV2lc7BSJvydVK1gijTSbc-9oDmPnOWQ55OJqmVFHOOhxsgJAZMAzKOCATXJZl2kpq-aQTQDyMuVCimN2EuMSAGpRw4Rdz7fh4A2tfXSD833ibbKgmX9yyfDh-sS6bhUT60Oy0u89DQ7Tx_njS2LoyyHFU3ZkdRfpbL-n7G0xf53dpQ_Pt_ezm4cUOS-GtOCFMdQ20ECp29q2HNu2EnVNFhqZ8woNt4SoRWlQWsux1NqQkLqUhUBZTtnlrncd_OeG4qBWLiJ1ne7Jb6IqmirnjYQRrHcgBh9jIKvWwa10-FY5qK0xtVS_xtTWmAKuRmNj8mJ_QkfUnQ26Rxf_4hKaohbVyN3sOBr__XIUVERHPZJxYexVxrt_b_0AFQGGOQ</recordid><startdate>20060915</startdate><enddate>20060915</enddate><creator>Yoo, B.Y.</creator><creator>Hernandez, S.C.</creator><creator>Park, D.-Y.</creator><creator>Myung, N.V.</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SE</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20060915</creationdate><title>Electrodeposition of FeCoNi thin films for magnetic-MEMS devices</title><author>Yoo, B.Y. ; Hernandez, S.C. ; Park, D.-Y. ; Myung, N.V.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c442t-242ddeb90903ab7fb4cbb5677ef098145cd4fecca63dc8ff4c3aade68a3826c83</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Chemistry</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Electrochemistry</topic><topic>Electrodeposition</topic><topic>Electrodeposition, electroplating</topic><topic>Exact sciences and technology</topic><topic>FeCoNi</topic><topic>Film stress</topic><topic>General and physical chemistry</topic><topic>Magnetic thin film</topic><topic>Materials science</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Microstructure</topic><topic>Physics</topic><topic>Study of interfaces</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yoo, B.Y.</creatorcontrib><creatorcontrib>Hernandez, S.C.</creatorcontrib><creatorcontrib>Park, D.-Y.</creatorcontrib><creatorcontrib>Myung, N.V.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Corrosion Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Electrochimica acta</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yoo, B.Y.</au><au>Hernandez, S.C.</au><au>Park, D.-Y.</au><au>Myung, N.V.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electrodeposition of FeCoNi thin films for magnetic-MEMS devices</atitle><jtitle>Electrochimica acta</jtitle><date>2006-09-15</date><risdate>2006</risdate><volume>51</volume><issue>28</issue><spage>6346</spage><epage>6352</epage><pages>6346-6352</pages><issn>0013-4686</issn><eissn>1873-3859</eissn><coden>ELCAAV</coden><notes>ObjectType-Article-2</notes><notes>SourceType-Scholarly Journals-1</notes><notes>ObjectType-Feature-1</notes><notes>content type line 23</notes><abstract>The physical properties, including macro and microstructures, film stress, and corrosion resistances, along with the magnetic properties of electrodeposited FeCoNi thin films, which can be later integrated to magnetic-MEMS devices were systematically investigated by varying film composition. Increased Ni content affected both macro and microstructure of electrodeposits, switching from columnar structure to lamellar structure and from body centered cubic (BCC) to face centered cubic (FCC), respectively. The film stress of electrodeposits was increased with increasing deposit Ni content and it was inversely proportional to grain size. The corrosion resistance of films determined by polarization resistance and pitting potential initially improved with increasing deposit nickel content, followed by a maximum at ∼48
at.% deposit Ni content. After reaching an upper limit, the corrosion resistance slightly decreased with increasing deposit Ni content. The coercivity of FeCoNi alloy decreased when Ni content increased from 0
at.% to ∼13
at.% which might be due to decrease in grain size. However, from ∼13
at.% to ∼48
at.%, coercivity increased, which could be predominately affected by changes in film stress and microstructure. Fe-rich FeCoNi thin films (e.g. 68Fe29Co 3Ni) show good magnetic properties with minimum film stress for magnetic-MEMS actuated in the out-of-plane direction.</abstract><cop>Oxford</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.electacta.2006.04.020</doi><tpages>7</tpages></addata></record> |
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| source | ScienceDirect Freedom Collection 2022-2024 |
| subjects | Chemistry Cross-disciplinary physics: materials science rheology Electrochemistry Electrodeposition Electrodeposition, electroplating Exact sciences and technology FeCoNi Film stress General and physical chemistry Magnetic thin film Materials science Methods of deposition of films and coatings film growth and epitaxy Microstructure Physics Study of interfaces |
| title | Electrodeposition of FeCoNi thin films for magnetic-MEMS devices |
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