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Robust thermal control for CMOS-based lab-on-chip systems

The need for precise temperature control at small scales has provided a formidable challenge to the lab-on-chip community. It requires, at once, good thermal conductivity for high speed operation, good thermal isolation for low power consumption and the ability to have small (mm-scale) thermally ind...

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Bibliographic Details
Published in:Journal of micromechanics and microengineering 2015-07, Vol.25 (7), p.75005-13
Main Authors: Martinez-Quijada, Jose, Ma, Tianchi, Hall, Gordon H, Reynolds, Matt, Sloan, David, Caverhill-Godkewitsch, Saul, Glerum, D Moira, Sameoto, Dan, Elliott, Duncan G, Backhouse, Christopher J
Format: Article
Language:English
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Summary:The need for precise temperature control at small scales has provided a formidable challenge to the lab-on-chip community. It requires, at once, good thermal conductivity for high speed operation, good thermal isolation for low power consumption and the ability to have small (mm-scale) thermally independent regions on the same substrate. Most importantly, and, in addition to these conflicting requirements, there is a need to accurately measure the temperature of the active region without the need for device-to-device calibrations. We have developed and tested a design that enables thermal control of lab-on-chip devices atop silicon substrates in a way that could be integrated with the standard methods of mass-manufacture used in the electronics industry (i.e. CMOS). This is a significant step towards a single-chip lab-on-chip solution, one in which the microfluidics, high voltage electronics, optoelectronics, instrumentation electronics, and the world-chip interface are all integrated on a single substrate with multiple, independent, thermally-controlled regions based on active heating and passive cooling.
ISSN:0960-1317
1361-6439
DOI:10.1088/0960-1317/25/7/075005