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Performance Improvement of Superconducting Tapes Due to Ferromagnetic Cover on Edges
Improvement of critical current and reduction of AC loss is presented for a common multifilamentary Bi-2223/Ag tape with thin nickel layer electroplated at the edges. Numerical calculations using a commercial finite-element code have been carried out to find the distributions of electrical current a...
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Published in: | IEEE transactions on applied superconductivity 2007-06, Vol.17 (2), p.3083-3086 |
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container_end_page | 3086 |
container_issue | 2 |
container_start_page | 3083 |
container_title | IEEE transactions on applied superconductivity |
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creator | Gomory, F. Souc, J. Seiler, E. Klincok, B. Vojenciak, M. Alamgir, A.K.M. Han, Z. Gu, C. |
description | Improvement of critical current and reduction of AC loss is presented for a common multifilamentary Bi-2223/Ag tape with thin nickel layer electroplated at the edges. Numerical calculations using a commercial finite-element code have been carried out to find the distributions of electrical current and magnetic field when the whole section is filled with the critical current density. The dependence of critical current density on local magnetic field and its orientation was taken into consideration, allowing to understand the mechanism of I c increase. Optimization of the cover thickness and width would be possible due to these calculations. AC loss was investigated experimentally in the condition of AC transport and simultaneous action of AC magnetic field in phase with transport current. Reduction of both the transport loss and the magnetization loss has been observed, as well as the loss at simultaneous action of transport AC and applied AC field. |
doi_str_mv | 10.1109/TASC.2007.900886 |
format | article |
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Numerical calculations using a commercial finite-element code have been carried out to find the distributions of electrical current and magnetic field when the whole section is filled with the critical current density. The dependence of critical current density on local magnetic field and its orientation was taken into consideration, allowing to understand the mechanism of I c increase. Optimization of the cover thickness and width would be possible due to these calculations. AC loss was investigated experimentally in the condition of AC transport and simultaneous action of AC magnetic field in phase with transport current. 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Electrical power engineering ; Electronics ; ELECTROPLATING ; Exact sciences and technology ; Ferromagnetism ; Finite element methods ; High temperature superconductors ; Insulation ; MAGNETIC FIELD ; Magnetic fields ; Magnetic losses ; MAGNETIC PROPERTIES ; Materials ; MATHEMATICAL ANALYSIS ; Microelectronic fabrication (materials and surfaces technology) ; Nickel ; Permeability ; REDUCTION ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; soft ferromagnetic cover ; Superconducting devices ; Superconducting films ; Superconducting tapes ; TAPE ; Transport</subject><ispartof>IEEE transactions on applied superconductivity, 2007-06, Vol.17 (2), p.3083-3086</ispartof><rights>2007 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2007</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c352t-b5d21285dd075de9ab8c20415ae123ce6eb16f5ac81f1d710521f8ef124430023</citedby><cites>FETCH-LOGICAL-c352t-b5d21285dd075de9ab8c20415ae123ce6eb16f5ac81f1d710521f8ef124430023</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4278108$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>310,311,315,786,790,795,796,23958,23959,25170,27957,27958,55147</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=19016952$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Gomory, F.</creatorcontrib><creatorcontrib>Souc, J.</creatorcontrib><creatorcontrib>Seiler, E.</creatorcontrib><creatorcontrib>Klincok, B.</creatorcontrib><creatorcontrib>Vojenciak, M.</creatorcontrib><creatorcontrib>Alamgir, A.K.M.</creatorcontrib><creatorcontrib>Han, Z.</creatorcontrib><creatorcontrib>Gu, C.</creatorcontrib><title>Performance Improvement of Superconducting Tapes Due to Ferromagnetic Cover on Edges</title><title>IEEE transactions on applied superconductivity</title><addtitle>TASC</addtitle><description>Improvement of critical current and reduction of AC loss is presented for a common multifilamentary Bi-2223/Ag tape with thin nickel layer electroplated at the edges. Numerical calculations using a commercial finite-element code have been carried out to find the distributions of electrical current and magnetic field when the whole section is filled with the critical current density. The dependence of critical current density on local magnetic field and its orientation was taken into consideration, allowing to understand the mechanism of I c increase. Optimization of the cover thickness and width would be possible due to these calculations. AC loss was investigated experimentally in the condition of AC transport and simultaneous action of AC magnetic field in phase with transport current. Reduction of both the transport loss and the magnetization loss has been observed, as well as the loss at simultaneous action of transport AC and applied AC field.</description><subject>AC losses</subject><subject>Alternating current</subject><subject>Applied sciences</subject><subject>Critical current</subject><subject>Critical current density</subject><subject>CURRENT</subject><subject>CURRENT DENSITY</subject><subject>DENSITY</subject><subject>Electrical engineering. Electrical power engineering</subject><subject>Electronics</subject><subject>ELECTROPLATING</subject><subject>Exact sciences and technology</subject><subject>Ferromagnetism</subject><subject>Finite element methods</subject><subject>High temperature superconductors</subject><subject>Insulation</subject><subject>MAGNETIC FIELD</subject><subject>Magnetic fields</subject><subject>Magnetic losses</subject><subject>MAGNETIC PROPERTIES</subject><subject>Materials</subject><subject>MATHEMATICAL ANALYSIS</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Nickel</subject><subject>Permeability</subject><subject>REDUCTION</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>soft ferromagnetic cover</subject><subject>Superconducting devices</subject><subject>Superconducting films</subject><subject>Superconducting tapes</subject><subject>TAPE</subject><subject>Transport</subject><issn>1051-8223</issn><issn>1558-2515</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNpdkMFLwzAUh4soqNO74CUI4qnzvbRp0-OYToWBwuY5ZOnL6FibmbSC_70ZEwVPCeT7vfzelyRXCGNEqO6Xk8V0zAHKcQUgZXGUnKEQMuUCxXG8g8BUcp6dJuchbAAwl7k4S5Zv5K3zre4MsZd2590ntdT1zFm2GHbkjevqwfRNt2ZLvaPAHgZivWMz8t61et1R3xg2jTHPXMce6zWFi-TE6m2gy59zlLzPHpfT53T--vQyncxTkwnepytRc-RS1DWUoqZKr6ThkKPQhDwzVNAKCyu0kWixLuMKHK0kizzPMwCejZK7w9xY-2Og0Ku2CYa2W92RG4KSssrKMi9kJG_-kRs3-C6WUxVyzkEiRAgOkPEuBE9W7XzTav-lENRestpLVnvJ6iA5Rm5_5upg9Nb66LEJf7kKsKjEvun1gWuI6Pc552X8V2bfzy6EPg</recordid><startdate>20070601</startdate><enddate>20070601</enddate><creator>Gomory, F.</creator><creator>Souc, J.</creator><creator>Seiler, E.</creator><creator>Klincok, B.</creator><creator>Vojenciak, M.</creator><creator>Alamgir, A.K.M.</creator><creator>Han, Z.</creator><creator>Gu, C.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Electrical power engineering</topic><topic>Electronics</topic><topic>ELECTROPLATING</topic><topic>Exact sciences and technology</topic><topic>Ferromagnetism</topic><topic>Finite element methods</topic><topic>High temperature superconductors</topic><topic>Insulation</topic><topic>MAGNETIC FIELD</topic><topic>Magnetic fields</topic><topic>Magnetic losses</topic><topic>MAGNETIC PROPERTIES</topic><topic>Materials</topic><topic>MATHEMATICAL ANALYSIS</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Nickel</topic><topic>Permeability</topic><topic>REDUCTION</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>soft ferromagnetic cover</topic><topic>Superconducting devices</topic><topic>Superconducting films</topic><topic>Superconducting tapes</topic><topic>TAPE</topic><topic>Transport</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Gomory, F.</creatorcontrib><creatorcontrib>Souc, J.</creatorcontrib><creatorcontrib>Seiler, E.</creatorcontrib><creatorcontrib>Klincok, B.</creatorcontrib><creatorcontrib>Vojenciak, M.</creatorcontrib><creatorcontrib>Alamgir, A.K.M.</creatorcontrib><creatorcontrib>Han, Z.</creatorcontrib><creatorcontrib>Gu, C.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>IEEE transactions on applied superconductivity</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Gomory, F.</au><au>Souc, J.</au><au>Seiler, E.</au><au>Klincok, B.</au><au>Vojenciak, M.</au><au>Alamgir, A.K.M.</au><au>Han, Z.</au><au>Gu, C.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Performance Improvement of Superconducting Tapes Due to Ferromagnetic Cover on Edges</atitle><jtitle>IEEE transactions on applied superconductivity</jtitle><stitle>TASC</stitle><date>2007-06-01</date><risdate>2007</risdate><volume>17</volume><issue>2</issue><spage>3083</spage><epage>3086</epage><pages>3083-3086</pages><issn>1051-8223</issn><eissn>1558-2515</eissn><coden>ITASE9</coden><notes>ObjectType-Article-2</notes><notes>SourceType-Scholarly Journals-1</notes><notes>ObjectType-Feature-1</notes><notes>content type line 23</notes><abstract>Improvement of critical current and reduction of AC loss is presented for a common multifilamentary Bi-2223/Ag tape with thin nickel layer electroplated at the edges. Numerical calculations using a commercial finite-element code have been carried out to find the distributions of electrical current and magnetic field when the whole section is filled with the critical current density. The dependence of critical current density on local magnetic field and its orientation was taken into consideration, allowing to understand the mechanism of I c increase. Optimization of the cover thickness and width would be possible due to these calculations. AC loss was investigated experimentally in the condition of AC transport and simultaneous action of AC magnetic field in phase with transport current. Reduction of both the transport loss and the magnetization loss has been observed, as well as the loss at simultaneous action of transport AC and applied AC field.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TASC.2007.900886</doi><tpages>4</tpages></addata></record> |
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subjects | AC losses Alternating current Applied sciences Critical current Critical current density CURRENT CURRENT DENSITY DENSITY Electrical engineering. Electrical power engineering Electronics ELECTROPLATING Exact sciences and technology Ferromagnetism Finite element methods High temperature superconductors Insulation MAGNETIC FIELD Magnetic fields Magnetic losses MAGNETIC PROPERTIES Materials MATHEMATICAL ANALYSIS Microelectronic fabrication (materials and surfaces technology) Nickel Permeability REDUCTION Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices soft ferromagnetic cover Superconducting devices Superconducting films Superconducting tapes TAPE Transport |
title | Performance Improvement of Superconducting Tapes Due to Ferromagnetic Cover on Edges |
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