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Monolithic 3D Integration of Analog RRAM‐Based Computing‐in‐Memory and Sensor for Energy‐Efficient Near‐Sensor Computing (Adv. Mater. 22/2024)

Near‐Sensor Computing In article number 2302658, Jianshi Tang and co‐workers demonstrate a prototype M3D‐SAIL chip for energy‐efficient near‐sensor computing by monolithic three‐dimensional integration of an IGZO‐FET based photosensor array, an analog RRAM‐based computing‐in‐memory array, and Si CMO...

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Published in:Advanced materials (Weinheim) 2024-05, Vol.36 (22), p.n/a
Main Authors: Du, Yiwei, Tang, Jianshi, Li, Yijun, Xi, Yue, Li, Yuankun, Li, Jiaming, Huang, Heyi, Qin, Qi, Zhang, Qingtian, Gao, Bin, Deng, Ning, Qian, He, Wu, Huaqiang
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container_title Advanced materials (Weinheim)
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creator Du, Yiwei
Tang, Jianshi
Li, Yijun
Xi, Yue
Li, Yuankun
Li, Jiaming
Huang, Heyi
Qin, Qi
Zhang, Qingtian
Gao, Bin
Deng, Ning
Qian, He
Wu, Huaqiang
description Near‐Sensor Computing In article number 2302658, Jianshi Tang and co‐workers demonstrate a prototype M3D‐SAIL chip for energy‐efficient near‐sensor computing by monolithic three‐dimensional integration of an IGZO‐FET based photosensor array, an analog RRAM‐based computing‐in‐memory array, and Si CMOS logic circuits. A video keyframe‐extraction task is implemented, achieving a high classification accuracy of 96.7% and 31.5× lower energy consumption and 1.91× faster computing speed compared to its 2D counterpart.
doi_str_mv 10.1002/adma.202470164
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subjects Analog circuits
Arrays
Computation
computing‐in‐memory
Energy consumption
Indium gallium zinc oxide
InGaZnOx field‐effect transistor
Logic circuits
monolithic 3D integration
near‐sensor computing
resistive random‐access memory
title Monolithic 3D Integration of Analog RRAM‐Based Computing‐in‐Memory and Sensor for Energy‐Efficient Near‐Sensor Computing (Adv. Mater. 22/2024)
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