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Multi-beam spark plasma sintering and excellent performance of Bi0.5Sb1.5Te3/epoxy thermoelectric films with insulating substrates
Fabricating high-performance large-size thermoelectric (TE) films with insulating substrates remains a major bottleneck for high-efficiency TE cooling in-plane heat dissipation. Herein, we have developed a multi-beam spark plasma sintering (MB-SPS) technology and used it to successfully prepare a se...
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Published in: | Energy & environmental science 2023-11, Vol.16 (11), p.5434-5443 |
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creator | Shaoqiu Ke Liang, Dong Nie, Xiaolei Ai, Xiaoling Li, Longzhou Liu, Chengshan Xu, Wenjie Cui, Wenjun Ye, Xianfeng Chen, Tiantian Li, Xiangyu Fu, Kai Zhu, Wanting Wei, Ping Zhao, Wenyu Zhang, Qingjie |
description | Fabricating high-performance large-size thermoelectric (TE) films with insulating substrates remains a major bottleneck for high-efficiency TE cooling in-plane heat dissipation. Herein, we have developed a multi-beam spark plasma sintering (MB-SPS) technology and used it to successfully prepare a series of high-performance large-size Bi0.5Sb1.5Te3/epoxy (BST/EP) TE films with insulating substrates (MB-BST/EP films). We found that the {000l} preferential orientation factor of BST in the MB-BST/EP films is about 69%, increased by 72.5% as compared with that of conventional SPS BST/EP films (C-BST/EP films), thus achieving remarkable enhancement in their electrical transport properties. The maximum power factor of the MB-BST/EP films is about 2.47 mW m−1 K−2 at 300 K. The maximum dimensionless figure of merit (zT) of the MB-BST/EP film without a substrate and MB-BST/EP film with an insulating substrate are about 0.91@350 K and 1.38@340 K, respectively. The maximum cooling temperature difference of the single-leg device fabricated with the MB-BST/EP film is about 1.7 K, an increase of 2.4 times as compared with that of the device fabricated with the C-BST/EP film. In particular, the microstructures and electrical transport properties of the MB-BST/EP films are almost the same over a large-size area of 25 mm in diameter. Our work demonstrates that the MB-SPS provides an effective approach to prepare high-performance large-size TE cooling films with an insulating substrate. |
doi_str_mv | 10.1039/d3ee02604c |
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Herein, we have developed a multi-beam spark plasma sintering (MB-SPS) technology and used it to successfully prepare a series of high-performance large-size Bi0.5Sb1.5Te3/epoxy (BST/EP) TE films with insulating substrates (MB-BST/EP films). We found that the {000l} preferential orientation factor of BST in the MB-BST/EP films is about 69%, increased by 72.5% as compared with that of conventional SPS BST/EP films (C-BST/EP films), thus achieving remarkable enhancement in their electrical transport properties. The maximum power factor of the MB-BST/EP films is about 2.47 mW m−1 K−2 at 300 K. The maximum dimensionless figure of merit (zT) of the MB-BST/EP film without a substrate and MB-BST/EP film with an insulating substrate are about 0.91@350 K and 1.38@340 K, respectively. The maximum cooling temperature difference of the single-leg device fabricated with the MB-BST/EP film is about 1.7 K, an increase of 2.4 times as compared with that of the device fabricated with the C-BST/EP film. In particular, the microstructures and electrical transport properties of the MB-BST/EP films are almost the same over a large-size area of 25 mm in diameter. Our work demonstrates that the MB-SPS provides an effective approach to prepare high-performance large-size TE cooling films with an insulating substrate.</description><identifier>ISSN: 1754-5692</identifier><identifier>EISSN: 1754-5706</identifier><identifier>DOI: 10.1039/d3ee02604c</identifier><language>eng</language><publisher>Cambridge: Royal Society of Chemistry</publisher><subject>Cooling ; Figure of merit ; Insulation ; Maximum power ; Plasma sintering ; Power factor ; Spark plasma sintering ; Substrates ; Thermoelectricity ; Transport properties</subject><ispartof>Energy & environmental science, 2023-11, Vol.16 (11), p.5434-5443</ispartof><rights>Copyright Royal Society of Chemistry 2023</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>315,786,790,27957,27958</link.rule.ids></links><search><creatorcontrib>Shaoqiu Ke</creatorcontrib><creatorcontrib>Liang, Dong</creatorcontrib><creatorcontrib>Nie, Xiaolei</creatorcontrib><creatorcontrib>Ai, Xiaoling</creatorcontrib><creatorcontrib>Li, Longzhou</creatorcontrib><creatorcontrib>Liu, Chengshan</creatorcontrib><creatorcontrib>Xu, Wenjie</creatorcontrib><creatorcontrib>Cui, Wenjun</creatorcontrib><creatorcontrib>Ye, Xianfeng</creatorcontrib><creatorcontrib>Chen, Tiantian</creatorcontrib><creatorcontrib>Li, Xiangyu</creatorcontrib><creatorcontrib>Fu, Kai</creatorcontrib><creatorcontrib>Zhu, Wanting</creatorcontrib><creatorcontrib>Wei, Ping</creatorcontrib><creatorcontrib>Zhao, Wenyu</creatorcontrib><creatorcontrib>Zhang, Qingjie</creatorcontrib><title>Multi-beam spark plasma sintering and excellent performance of Bi0.5Sb1.5Te3/epoxy thermoelectric films with insulating substrates</title><title>Energy & environmental science</title><description>Fabricating high-performance large-size thermoelectric (TE) films with insulating substrates remains a major bottleneck for high-efficiency TE cooling in-plane heat dissipation. Herein, we have developed a multi-beam spark plasma sintering (MB-SPS) technology and used it to successfully prepare a series of high-performance large-size Bi0.5Sb1.5Te3/epoxy (BST/EP) TE films with insulating substrates (MB-BST/EP films). We found that the {000l} preferential orientation factor of BST in the MB-BST/EP films is about 69%, increased by 72.5% as compared with that of conventional SPS BST/EP films (C-BST/EP films), thus achieving remarkable enhancement in their electrical transport properties. The maximum power factor of the MB-BST/EP films is about 2.47 mW m−1 K−2 at 300 K. The maximum dimensionless figure of merit (zT) of the MB-BST/EP film without a substrate and MB-BST/EP film with an insulating substrate are about 0.91@350 K and 1.38@340 K, respectively. The maximum cooling temperature difference of the single-leg device fabricated with the MB-BST/EP film is about 1.7 K, an increase of 2.4 times as compared with that of the device fabricated with the C-BST/EP film. In particular, the microstructures and electrical transport properties of the MB-BST/EP films are almost the same over a large-size area of 25 mm in diameter. Our work demonstrates that the MB-SPS provides an effective approach to prepare high-performance large-size TE cooling films with an insulating substrate.</description><subject>Cooling</subject><subject>Figure of merit</subject><subject>Insulation</subject><subject>Maximum power</subject><subject>Plasma sintering</subject><subject>Power factor</subject><subject>Spark plasma sintering</subject><subject>Substrates</subject><subject>Thermoelectricity</subject><subject>Transport properties</subject><issn>1754-5692</issn><issn>1754-5706</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><recordid>eNo1jj1PwzAURS0EEqWw8AssMad9tmMnGaHiSwIxUObKcZ-pi-ME2xFl5ZdTBEz3LPfcS8g5gxkD0czXAhG4gtIckAmrZFnICtThP6uGH5OTlLYAikPVTMjX4-izK1rUHU2Djm908Dp1miYXMkYXXqkOa4o7g95jyHTAaPvY6WCQ9pZeOZjJ55bN5BLFHId-90nzBmPXo0eTozPUOt8l-uHyhrqQRq_zjzWNbcpRZ0yn5Mhqn_DsL6fk5eZ6ubgrHp5u7xeXD8XAapGLcv9ecJSNLddSMV1DbRouoRItommsMVIZa3RboYZacw7CKJCqbRuxr2oxJRe_3iH27yOmvNr2Ywz7yRWv6wpKgJKJbxrIYy8</recordid><startdate>20231108</startdate><enddate>20231108</enddate><creator>Shaoqiu Ke</creator><creator>Liang, Dong</creator><creator>Nie, Xiaolei</creator><creator>Ai, Xiaoling</creator><creator>Li, Longzhou</creator><creator>Liu, Chengshan</creator><creator>Xu, Wenjie</creator><creator>Cui, Wenjun</creator><creator>Ye, Xianfeng</creator><creator>Chen, Tiantian</creator><creator>Li, Xiangyu</creator><creator>Fu, Kai</creator><creator>Zhu, Wanting</creator><creator>Wei, Ping</creator><creator>Zhao, Wenyu</creator><creator>Zhang, Qingjie</creator><general>Royal Society of Chemistry</general><scope>7SP</scope><scope>7ST</scope><scope>7TB</scope><scope>8FD</scope><scope>C1K</scope><scope>FR3</scope><scope>L7M</scope><scope>SOI</scope></search><sort><creationdate>20231108</creationdate><title>Multi-beam spark plasma sintering and excellent performance of Bi0.5Sb1.5Te3/epoxy thermoelectric films with insulating substrates</title><author>Shaoqiu Ke ; Liang, Dong ; Nie, Xiaolei ; Ai, Xiaoling ; Li, Longzhou ; Liu, Chengshan ; Xu, Wenjie ; Cui, Wenjun ; Ye, Xianfeng ; Chen, Tiantian ; Li, Xiangyu ; Fu, Kai ; Zhu, Wanting ; Wei, Ping ; Zhao, Wenyu ; Zhang, Qingjie</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-p183t-456932e59f4d561a808c925073beec9fcc56cfcab7ea08a2203c6056bb93569a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Cooling</topic><topic>Figure of merit</topic><topic>Insulation</topic><topic>Maximum power</topic><topic>Plasma sintering</topic><topic>Power factor</topic><topic>Spark plasma sintering</topic><topic>Substrates</topic><topic>Thermoelectricity</topic><topic>Transport properties</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Shaoqiu Ke</creatorcontrib><creatorcontrib>Liang, Dong</creatorcontrib><creatorcontrib>Nie, Xiaolei</creatorcontrib><creatorcontrib>Ai, Xiaoling</creatorcontrib><creatorcontrib>Li, Longzhou</creatorcontrib><creatorcontrib>Liu, Chengshan</creatorcontrib><creatorcontrib>Xu, Wenjie</creatorcontrib><creatorcontrib>Cui, Wenjun</creatorcontrib><creatorcontrib>Ye, Xianfeng</creatorcontrib><creatorcontrib>Chen, Tiantian</creatorcontrib><creatorcontrib>Li, Xiangyu</creatorcontrib><creatorcontrib>Fu, Kai</creatorcontrib><creatorcontrib>Zhu, Wanting</creatorcontrib><creatorcontrib>Wei, Ping</creatorcontrib><creatorcontrib>Zhao, Wenyu</creatorcontrib><creatorcontrib>Zhang, Qingjie</creatorcontrib><collection>Electronics & Communications Abstracts</collection><collection>Environment Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Environmental Sciences and Pollution Management</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Environment Abstracts</collection><jtitle>Energy & environmental science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Shaoqiu Ke</au><au>Liang, Dong</au><au>Nie, Xiaolei</au><au>Ai, Xiaoling</au><au>Li, Longzhou</au><au>Liu, Chengshan</au><au>Xu, Wenjie</au><au>Cui, Wenjun</au><au>Ye, Xianfeng</au><au>Chen, Tiantian</au><au>Li, Xiangyu</au><au>Fu, Kai</au><au>Zhu, Wanting</au><au>Wei, Ping</au><au>Zhao, Wenyu</au><au>Zhang, Qingjie</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Multi-beam spark plasma sintering and excellent performance of Bi0.5Sb1.5Te3/epoxy thermoelectric films with insulating substrates</atitle><jtitle>Energy & environmental science</jtitle><date>2023-11-08</date><risdate>2023</risdate><volume>16</volume><issue>11</issue><spage>5434</spage><epage>5443</epage><pages>5434-5443</pages><issn>1754-5692</issn><eissn>1754-5706</eissn><abstract>Fabricating high-performance large-size thermoelectric (TE) films with insulating substrates remains a major bottleneck for high-efficiency TE cooling in-plane heat dissipation. Herein, we have developed a multi-beam spark plasma sintering (MB-SPS) technology and used it to successfully prepare a series of high-performance large-size Bi0.5Sb1.5Te3/epoxy (BST/EP) TE films with insulating substrates (MB-BST/EP films). We found that the {000l} preferential orientation factor of BST in the MB-BST/EP films is about 69%, increased by 72.5% as compared with that of conventional SPS BST/EP films (C-BST/EP films), thus achieving remarkable enhancement in their electrical transport properties. The maximum power factor of the MB-BST/EP films is about 2.47 mW m−1 K−2 at 300 K. The maximum dimensionless figure of merit (zT) of the MB-BST/EP film without a substrate and MB-BST/EP film with an insulating substrate are about 0.91@350 K and 1.38@340 K, respectively. The maximum cooling temperature difference of the single-leg device fabricated with the MB-BST/EP film is about 1.7 K, an increase of 2.4 times as compared with that of the device fabricated with the C-BST/EP film. In particular, the microstructures and electrical transport properties of the MB-BST/EP films are almost the same over a large-size area of 25 mm in diameter. Our work demonstrates that the MB-SPS provides an effective approach to prepare high-performance large-size TE cooling films with an insulating substrate.</abstract><cop>Cambridge</cop><pub>Royal Society of Chemistry</pub><doi>10.1039/d3ee02604c</doi><tpages>10</tpages></addata></record> |
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subjects | Cooling Figure of merit Insulation Maximum power Plasma sintering Power factor Spark plasma sintering Substrates Thermoelectricity Transport properties |
title | Multi-beam spark plasma sintering and excellent performance of Bi0.5Sb1.5Te3/epoxy thermoelectric films with insulating substrates |
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