Electromigration immortality of purely intermetallic micro -bump for 3D integration

The progress of three-dimensional integrated circuit (3D IC) micro-bump joining technology has led to an increased volume fraction of intermetallics (IMC) in the post reflow joints, to an extent that a solder micro-bump may consist almost entirely of IMCs. Therefore, the current carrying capability...

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Main Authors: Hsiao-Yun Chen, Chih-Hang Tung, Yi-Li Hsiao, Jyun-lin Wu, Tung-Ching Yeh, Lin, Larry Liang-Chen, Chih Chen, Yu, Douglas Cheng-Hua
Format: Conference Proceeding
Language:English
Subjects:
Electromigration
Electronic components
Integrated circuit interconnections
Joints
Resistance
Soldering
Three-dimensional displays
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creator Hsiao-Yun Chen
Chih-Hang Tung
Yi-Li Hsiao
Jyun-lin Wu
Tung-Ching Yeh
Lin, Larry Liang-Chen
Chih Chen
Yu, Douglas Cheng-Hua
description The progress of three-dimensional integrated circuit (3D IC) micro-bump joining technology has led to an increased volume fraction of intermetallics (IMC) in the post reflow joints, to an extent that a solder micro-bump may consist almost entirely of IMCs. Therefore, the current carrying capability and electromigration (EM) life time of the purely IMC micro-joint needs to be understood as functions of stressing conditions and degradation mechanisms. Superior EM performance and robustness of IMC joints is demonstrated with no resistance fluctuation under ultra-high stressing condition for over 9000 hrs while solder micro-bumps led to an open failure within 500 hrs. At least an order of magnitude greater current carrying capability of IMC micro-joint compared with solder micro-joint is observed experimentally. The observed degradation mechanism is void formation within Al trace rather than damage inside IMC joint. IMC joint is not the EM reliability bottle neck of the test circuit.
doi_str_mv 10.1109/ECTC.2015.7159656
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subjects Electromigration
Electronic components
Integrated circuit interconnections
Joints
Resistance
Soldering
Three-dimensional displays
title Electromigration immortality of purely intermetallic micro -bump for 3D integration
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