Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging

This paper describes wafer level vacuum packaging with sub-micron Au particles for MEMS (micro electro mechanical systems) applications. Low temperature bonding is indispensable for relevant MEMS packaging, and use of sub-micron Au particles are suitable for hermetic seal bonding. For the fabricatio...

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Main Authors: Ito, S., Ogashiwa, T., Kanehira, Y., Ishida, H., Shoji, S., Mizuno, J.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Gold
Micromechanical devices
Packaging
Seals
Silicon
Structural rings
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creator Ito, S.
Ogashiwa, T.
Kanehira, Y.
Ishida, H.
Shoji, S.
Mizuno, J.
description This paper describes wafer level vacuum packaging with sub-micron Au particles for MEMS (micro electro mechanical systems) applications. Low temperature bonding is indispensable for relevant MEMS packaging, and use of sub-micron Au particles are suitable for hermetic seal bonding. For the fabrication of hermetically sealed wafer level packaging, a base silicon wafer and a cap glass wafer were bonded at around 200°C. Before bonding, the surface of seal rings was observed with a laser microscope to investigate the effect of surface roughness for hermeticity. After bonding, bonded wafers were dipped in the hydrofluoroether for 30 min. As a result, surface flatness of Au particles contributed to achieve hermetic sealing. Double seal rings structures were also useful to realize hermetic sealing.
doi_str_mv 10.1109/ISAPM.2011.6105749
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subjects Bonding
Gold
Micromechanical devices
Packaging
Seals
Silicon
Structural rings
title Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging
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