Layer-thickness simulation for static thin-film deposition on Gen 6/Gen 7 substrates

— The movement of particles from a target to a substrate during the sputter process was studied using the Monte Carlo Simulation technique. The momentum and energy distribution of the ejected particles were taken into account along with the change of momentum and energy in their collisions with gas...

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Published in:Journal of the Society for Information Display 2006-01, Vol.14 (1), p.31-36
Main Authors: Lopp, Andreas, Bangert, Stefan, Buschbeck, Wolfgang, Hanika, Markus, König, Michael, Krempel-Hesse, Jörg, Rost, Harald, Schroeder, Jürgen, Stolley, Tobias
Format: Article
Language:English
Subjects:
layer thickness distribution
Monte Carlo simulation
pressure reduction
sputter process
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creator Lopp, Andreas
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Hanika, Markus
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Schroeder, Jürgen
Stolley, Tobias
description — The movement of particles from a target to a substrate during the sputter process was studied using the Monte Carlo Simulation technique. The momentum and energy distribution of the ejected particles were taken into account along with the change of momentum and energy in their collisions with gas atoms. The momentum transfer from the ejected target atom to the gas atom was used to estimate the gas rarefaction in front of the target. Layer‐thickness distributions of different target materials were calculated and compared with experimental measurements. The results were used to optimize the uniformity of static thin‐film depositions on Gen 6/Gen 7 substrates from a large‐area cathode array.
doi_str_mv 10.1889/1.2166832
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subjects layer thickness distribution
Monte Carlo simulation
pressure reduction
sputter process
title Layer-thickness simulation for static thin-film deposition on Gen 6/Gen 7 substrates
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