Vertical channel devices enabled by through silicon via (TSV) technologies by Kothandaraman, C., Rosenblatt, S., Safran, J., Oldiges, P., Kulkarni-Kerber, P., Xumalo, J., Landers, W., Liu, J., Oakley, J. A., Butt, S., Graves-Abe, T. L., Robson, N., Farooq, M. G., Berger, D., Iyer, S. S.

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