Search Results - Shue, Winston S.
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Effect of Cu Line Capping Process on Stress Migration Reliability
Conference Proceeding -
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Design of ECP additive for 65 nm-node technology Cu BEOL reliability
Conference Proceeding -
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Direct plating of Cu on ALD TaN for 45nm node Cu BEOL metallization
Conference Proceeding -
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A 90nm generation copper dual damascene technology with ALD TaN barrier
Conference Proceeding -
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Intercalated Graphene as Next Generation Back-end-of-Line Conductors
Conference Proceeding