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    Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy

    Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy by Roduan, Siti Faqihah, Wahab, Juyana A, Salleh, Mohd Arif Anuar Mohd, Mahayuddin, Nurul Aida Husna Mohd, Abdullah, Mohd Mustafa Al Bakri, Halil, Aiman Bin Mohd, Zaifuddin, Amira Qistina Syamimi, Muhammad, Mahadzir Ishak, Sandu, Andrei Victor, Baltatu, Mădălina Simona, Vizureanu, Petrica

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