Search Results - Liu, Monsen

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  1. 1
    Heterogeneous and Chiplet Integration Using Organic Interposer (CoWoS-R)

    Heterogeneous and Chiplet Integration Using Organic Interposer (CoWoS-R) by Jeng, Shin-Puu, Liu, Monsen

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  2. 2
    Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications

    Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications by Tsai, Chung-Hao, Hsieh, Jeng-Shien, Liu, Monsen, Yeh, En-Hsiang, Chen, Hsu-Hsien, Hsiao, Ching-Wen, Chen, Chen-Shien, Liu, Chung-Shi, Lii, Mirng-Ji, Wang, Chuei-Tang, Yu, Doug

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  3. 3
    Nanoscale surface modification of La0.7Sr0.3MnO3 thin films

    Nanoscale surface modification of La0.7Sr0.3MnO3 thin films by Liu, Y., Monsen, Å. F., Boschker, J. E., Wahlström, E., Borg, A., Tybell, T.

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  4. 4
    Real-time DSP for 100+ Gb/s

    Real-time DSP for 100+ Gb/s by Rasmussen, C., Pan, Y., Aydinlik, M., Crowley, M., Geyer, J. C., Humblet, P., Liu, F., Mikkelsen, B., Monsen, P., Nadarajah, N., Pendock, G., Shah, B.

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