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Electromigration immortality of purely intermetallic micro -bump for 3D integration
by
Hsiao-Yun Chen
,
Chih-Hang Tung
,
Yi-Li Hsiao
,
Jyun-lin Wu
,
Tung-Ching Yeh
,
Lin, Larry Liang-Chen
,
Chih Chen
,
Yu, Douglas Cheng-Hua
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Computer Science
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Computer Science, Theory & Methods
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Electromigration
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Electronic Components
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Engineering
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Engineering, Electrical & Electronic
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Integrated Circuit Interconnections
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Joints
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Resistance
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Science & Technology
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Soldering
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Three-Dimensional Displays
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Ieee Electronic Library (Iel) Conference Proceedings
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