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    Advanced Cu chemical displacement technique for SiO2-based electrochemical metallization ReRAM application

    Advanced Cu chemical displacement technique for SiO2-based electrochemical metallization ReRAM application by Chin, Fun-Tat, Lin, Yu-Hsien, You, Hsin-Chiang, Yang, Wen-Luh, Lin, Li-Min, Hsiao, Yu-Ping, Ko, Chum-Min, Chao, Tien-Sheng

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