Suppression of leakage magnetic field from a wireless power transfer system using ferrimagnetic material and metallic shielding by Hongseok Kim, Jonghyun Cho, Seungyoung Ahn, Jonghoon Kim, Joungho Kim

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A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs by KIM, Myunghoi, KOO, Kyoungchoul, HWANG, Chulsoon, SHIM, Yujeong, KIM, Joungho, KIM, Jonghoon

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Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory) by Dae Hyun Kim, Athikulwongse, Krit, Healy, Michael B., Hossain, Mohammad M., Moongon Jung, Khorosh, Ilya, Kumar, Gokul, Young-Joon Lee, Lewis, Dean L., Tzu-Wei Lin, Chang Liu, Panth, Shreepad, Pathak, Mohit, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Loh, Gabriel H., Lee, Hsien-Hsin S., Sung Kyu Lim

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High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via by Kim, Joohee, Cho, Jonghyun, Kim, Joungho, Yook, Jong-Min, Kim, Jun Chul, Lee, Junho, Park, Kunwoo, Pak, Jun So

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An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC by Sumin Choi, Heegon Kim, Jung, Daniel H., Kim, Jonghoon Jay, Jaemin Lim, Joungho Kim

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Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis by Piersanti, Stefano, Pellegrino, Enza, de Paulis, Francesco, Orlandi, Antonio, Jung, Daniel H., Dong-Hyun Kim, Joungho Kim, Jun Fan

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Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel by Youngwoo Kim, Jonghyun Cho, Kim, Jonghoon J., Kiyeong Kim, Kyungjun Cho, Subin Kim, Sitaraman, Srikrishna, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao, Joungho Kim

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Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules by Sitaraman, Srikrishna, Sukumaran, Vijay, Pulugurtha, Markondeya Raj, Zihan Wu, Suzuki, Yuya, Youngwoo Kim, Sundaram, Venky, Joungho Kim, Tummala, Rao R.

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Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications by Jongbae Park, Lu, A.C.W., Chua, K.M., Wai, L.L., Junho Lee, Joungho Kim

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Multiport Measurement Method Using a Two-Port Network Analyzer With Remaining Ports Unterminated by DONG GUN KAM, KIM, Joungho

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A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection by Zhang, Shuye, Park, Junyong, Park, Gapyeol, Song, Huijin, Kim, Joungho, Paik, Kyung-Wook, He, Peng

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Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling by Youngwoo Kim, Jonghyun Cho, Kim, Jonghoon J., Kyungjun Cho, Subin Kim, Sitaraman, Srikrishna, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao R., Joungho Kim

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Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias by Piersanti, Stefano, De Paulis, Francesco, Orlandi, Antonio, Dong-Hyun Kim, Joungho Kim, Jun Fan

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Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation by Bumhee Bae, Kim, Jonghoon J., Sukjin Kim, Sunkyu Kong, Joungho Kim

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System-on-package ultra-wideband transmitter using CMOS impulse generator by Junwoo Lee, Young-Jin Park, Myunghoi Kim, Yoon, C., Kim, Joungho, Kwan-Ho Kim

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Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis by Bae, Bumhee, Shim, Yujeong, Koo, Kyoungchoul, Cho, Jonghyun, Pak, Jun So, Kim, Joungho

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High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling by Sukjin Kim, Jung, Daniel H., Kim, Jonghoon J., Bumhee Bae, Sunkyu Kong, Seungyoung Ahn, Jonghoon Kim, Joungho Kim

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Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays by Jingook Kim, Shringarpure, K, Jun Fan, Joungho Kim, Drewniak, J L

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Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package by SHIM, Yujeong, PARK, Jongbae, KIM, Jaemin, SONG, Eakhwan, YOO, Jeongsik, PAK, Junso, KIM, Joungho

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Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC by Liu, Chang, Song, Taigon, Cho, Jonghyun, Kim, Joohee, Kim, Joungho, Lim, Sung Kyu

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