Search Results - Huynh, Thi M.T.

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  1. 1
    On the role of halides and thiols in additive-assisted copper electroplating

    On the role of halides and thiols in additive-assisted copper electroplating by Huynh, Thi M.T., Weiss, Florian, Hai, Nguyen T.M., Reckien, Werner, Bredow, Thomas, Fluegel, Alexander, Arnold, Marco, Mayer, Dieter, Keller, Hubert, Broekmann, Peter

    Published in Electrochimica acta
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  2. 2
    Competitive Anion/Water and Cation/Water Interactions at Electrified Copper/Electrolyte Interfaces Probed by in Situ X-ray Diffraction

    Competitive Anion/Water and Cation/Water Interactions at Electrified Copper/Electrolyte Interfaces Probed by in Situ X-ray Diffraction by Keller, Hubert, Saracino, Martino, Nguyen, Hai M.T, Huynh, Thi Mien Trung, Broekmann, Peter

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