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Study of Cu Bimetallic Corrosion in CMP Chemical Environments Using Optical Scanning and Micropattern Corrosion Screening
by
Yu, Kyle
,
Thomas, Nicole
,
Venkataraman, Shyam S.
,
Pillai, Karthikeyan S.
,
Hurd, Trace
,
Boggs, Karl
,
Chyan, Oliver
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(Invited) Wet Etching inside Advanced High Aspect Ratio Structures: Impact of Dissolved Oxygen
by
Sakazaki, Tetsuya
,
Kosugi, Hitoshi
,
Bassett, Derek W
,
Simms, Ihsan
,
Rotondaro, Antonio
,
Hurd, Trace
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ECS transactions
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Interfacial Diffusion Studies of Cu/(5 nm Ru)/Si Structures Physical Vapor Deposited vs Electrochemically Deposited Cu
by
Arunagiri, Tiruchirapalli N
,
Zhang, Yibin
,
Chyan, Oliver
,
Kim, Moon J
,
Hurde, Trace Q
Published in
Journal of the Electrochemical Society
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H2O2 decomposition and its impact on silicon surface roughening and gate oxide integrity
by
SCHMIDT, H. F
,
MEURIS, M
,
MERTENS, P. W
,
ROTONDARO, A. L. P
,
HEYNS, M. M
,
HURD, T. Q
,
HATCHER, Z
Published in
Japanese journal of applied physics
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Interfacial Diffusion Studies of Cu∕(5 nm Ru)∕Si Structures
by
Arunagiri, Tiruchirapalli N.
,
Zhang, Yibin
,
Chyan, Oliver
,
Kim, Moon J.
,
Hurd, Trace Q.
Published in
Journal of the Electrochemical Society
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H 2 O 2 Decomposition and Its Impact on Silicon Surface Roughening and Gate Oxide Integrity
by
Schmidt, Harald F.
,
Meuris, Marc
,
Mertens, Paul W.
,
Rotondaro, Antonio L. P.
,
Heyns, Marc M.
,
Hurd, Trace Q.
,
Hatcher, Zach
Published in
Japanese Journal of Applied Physics
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Advantages of wet chemical spin-processing for wafer thinning and packaging applications
by
Hendrix, M.
,
Drews, S.
,
Hurd, T.
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The preparation of the first α-vinylidenepenams
by
Buynak, John D.
,
Borate, H.B.
,
Husting, Chad
,
Hurd, Trace
,
Vallabh, Jyoti
,
Matthew, Jacob
,
Lambert, Jarvis
,
Siriwardane, Upali
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Tetrahedron letters
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Ruthenium-based copper diffusion barrier: Studied by electrochemistry, SIMS depth profiling and sheet resistance measurements
by
CHYAN, Oliver
,
CHAN, Raymond
,
ARUNAGIRI, Tiruchirapalli
,
WALLACE, Robert M
,
KIM, Moon J
,
HURD, Trace
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